Description
Issued in August of 2023, the EuroHPC JU’s call for proposals for Innovation Action in Low Latency and High Bandwidth Interconnects closed on January 31, 2024. Intended to support and provide synergies with other EuroHPC I/O, processor, and accelerator programs, proposals were to: Develop a roadmap for European scalable inter-node interconnects targeting HPC exascale and post-exascale systems; Include the inter-node interconnect hardware, address design, development, testing and tape-out, as well as outline the integration into testbeds; Encompass the software, installation, configuration, and management tools for the developed interconnect, driven by the needs of relevant HPC workflows and application requirements; Address a broad range of system requirements (e.g., high bandwidth, low latency, power efficiency, virtualization, scalability, reliability, security).
